> Looks like it will get very hot in there. No vents to dissipate heat,
at least through convection?
Bottom convection holes and the top holes exist, no problems seen so far concerning thermal. This is a full aluminium case, the entire case dissipates heat as it is thermally connected to the heat generating parts of the RPI.
> Not depicted: Access to the TF card slot without disassembly of the case?
There should be no need, but if, 4 screws are to be removed
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